The blog discusses the intense competition between Micron and SK hynix in the race to develop the next generation of AI with their HBM4 technology. SK hynix has already shipped samples of their 12-layer HBM4, boasting impressive data processing capabilities. Micron is closely following suit, pending Nvidia’s tests for their HBM4 samples and aiming to mass produce in 2026. Meanwhile, Samsung is facing challenges with Yield Ramp on HBM4 development, causing delays in their milestones.
One key differentiator among the competitors is the base die that anchors the DRAM stack. SK hynix and Samsung have introduced a logic-enabled base die on advanced process technology to enhance the efficiency and performance of their HBM4 products. Both companies rely on TSMC for the production of these base dies. However, it remains uncertain whether Micron is using a logic base die, as they do not have in-house capabilities to fabricate at the same level as their competitors.
Overall, the race to power the next generation of AI through HBM4 technology is heating up, with each company striving to push the boundaries of data processing capabilities. The competition between Micron, SK hynix, and Samsung highlights the importance of innovation and technological advancements in the AI industry.
