Accelsius Achieves Major Milestones in Thermal Testing
Accelsius has recently reached two significant milestones in thermal testing, showcasing the impressive performance and scalability of its innovative two-phase, direct-to-chip NeuCoolâ„¢ solution. These advancements address crucial cooling challenges for next-generation AI infrastructure while also promoting sustainability through enhanced energy efficiency.
Unprecedented Cooling Capacity
One of the key milestones involved testing a thermal test vehicle that mimicked a GPU socket in preparation for the upcoming wave of ultra-high-power GPUs. During the experiment, the cold plate was heated up to an impressive 4,500W before hitting the power limit of the test infrastructure, rather than the cooling system itself. Remarkably, the cold-plate temperatures remained stable and within operational limits even under such extreme loads. This achievement marks the highest cooling capacity ever achieved in the industry for direct-to-chip liquid cooling, proving that NeuCool has the thermal headroom to support multiple future generations of processors.
Efficient Cooling of AI Servers
In a separate test, Accelsius successfully demonstrated the effectiveness of its in-row two-phase CDU in cooling a full 250kW rack of AI servers. By retrofitting a four-way H100 server with two-phase cold plates that made direct contact with the switches, CPUs, and GPUs, and then placing it in a densely configured 250kW rack, Accelsius showcased the capabilities of its cooling solution.
The CDU underwent testing with facility water (PG25) at varying temperatures and flow rates. Even under maximum rack load and using warm 40°C inlet temperatures, the junction temperature of the hottest GPU remained well below the thermal throttle limit set by NVIDIA (~87°C), highlighting the efficiency of two-phase cooling in warm-water environments. This ability to operate with facility water at higher temperatures can result in significant cooling energy savings and increased free cooling hours, depending on the local climate.
Future-Ready Solutions
Dr. Richard Bonner, chief technical officer at Accelsius, emphasized the company’s readiness to meet current performance demands and adapt to evolving chip and server architectures. With the ability to scale up to the requirements of 600kW racks and beyond, Accelsius is well-positioned to support the needs of data center operators in the AI and HPC space.
Meet Accelsius at Industry Events
Accelsius will be showcasing its innovative cold-plate research at Data Center World in Washington, DC, from April 15–17 (Booth #524), where attendees can learn more about the company’s recent test campaigns and the future of thermal management in data centers. Additionally, Accelsius will be presenting at the OCP EMEA Summit’s Future Technologies Symposium in Dublin, Ireland, on April 29, focusing on cooling solutions for vertically oriented servers, such as those required for next-generation NVIDIA Kyber racks.
