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Silicon Flash > Blog > Innovations > Advancing Semiconductor Manufacturing: Atomic-Level Hafnium Oxide Etching Using Halogen-Free Plasma Technology
Innovations

Advancing Semiconductor Manufacturing: Atomic-Level Hafnium Oxide Etching Using Halogen-Free Plasma Technology

Published September 9, 2025 By Juwan Chacko
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Advancing Semiconductor Manufacturing: Atomic-Level Hafnium Oxide Etching Using Halogen-Free Plasma Technology
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Hafnium oxide, known as HfO2, has emerged as a promising material for next-generation semiconductors and microelectronic devices. Its unique properties, such as a high dielectric constant and thermal stability, make it ideal for advanced applications. However, achieving precise and smooth etching of HfO2 films has been a challenge in the industry. Recently, a team of researchers from Japan and Taiwan has made a breakthrough in atomic-level etching of HfO2 films, paving the way for sustainable and efficient manufacturing processes in the semiconductor industry.

The Promise of Hafnium Oxide in Semiconductor Technology

Hafnium oxide (HfO2) has garnered significant attention as a promising material for ultrathin semiconductors and other microelectronic devices. The strong ionic bond between hafnium and oxygen atoms in HfO2 gives it a high dielectric constant, superior thermal stability, and a wide band gap.

Contents
The Promise of Hafnium Oxide in Semiconductor TechnologyBreaking New Ground in Atomic-Level EtchingInnovative Etching Methodology

These properties are crucial for maintaining performance even at the atomic scale. However, they also present challenges when it comes to achieving highly precise and smooth etching of HfO2 films.

Breaking New Ground in Atomic-Level Etching

A recent collaborative effort between researchers from Japan and Taiwan has led to a significant advancement in the etching of HfO2 films. The team successfully etched HfO2 films with atomic-level precision, smoothness, and uniformity without the use of halogen-based gases, which are commonly used in traditional etching methods but pose environmental and health risks.

Published in Small Science, this achievement marks a milestone in sustainable manufacturing practices within the semiconductor industry.

Innovative Etching Methodology

The researchers employed a novel approach to etching HfO2 films, utilizing a low-pressure, high-density plasma generation device to irradiate the films with N2 and O2 plasmas alternately. This method allowed for precise control over the etching process, resulting in smooth and uniform surfaces with consistent etched depths.

See also  Improved Cathode Chemistry Reduces Self-Discharge in Large-Scale Zinc-Iodine Batteries

By eliminating the use of halogen-based gases and optimizing the etching process, the team achieved subatomic-level precision while maintaining environmental sustainability in semiconductor manufacturing.

Conclusion

This groundbreaking research not only advances the field of semiconductor technology but also sets a new standard for environmentally conscious manufacturing practices. The successful atomic-level etching of HfO2 films opens up new possibilities for the development of next-generation semiconductor devices, paving the way for a cleaner and more efficient industry.

More information:
Shih‐Nan Hsiao et al, Halogen‐Free Anisotropic Atomic‐Layer Etching of HfO2 at Room Temperature, Small Science (2025). DOI: 10.1002/smsc.202500251
Provided by Nagoya University




TAGGED: Advancing, AtomicLevel, Etching, Hafnium, HalogenFree, manufacturing, Oxide, Plasma, Semiconductor, technology
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