nVent has introduced a range of new modular liquid cooling solutions for data centers, designed to meet the evolving cooling requirements of chip manufacturers. The new offerings include upgraded coolant distribution unit (CDU) options, advanced technology cooling system (TCS) manifolds, and updated racks based on leading reference designs. These solutions were showcased at SC25 alongside nVent’s intelligent power distribution units (PDUs).
Eric Osborn, General Manager of nVent Data Solutions, emphasized the company’s commitment to innovation in liquid cooling and power solutions. The new portfolio includes scalable row-based CDUs, next-generation PDUs, AC and DC rack CDUs, and TCS manifolds to support the expanding AI landscape in data centers. By offering a common control platform, nVent aims to enhance reliability and user experience for data center operators.
In collaboration with industry leaders like Siemens, nVent is focusing on developing infrastructure solutions that align with next-generation reference architectures. The partnership aims to address the increasing power densities and workload demands faced by modern data centers. Additionally, nVent is actively involved in Project Deschutes, contributing to the advancement of liquid cooling technology within the data center industry.
