The MLX-A1 AI Box showcases Mobilint’s silicon technology alongside Aetina’s system integration for autonomous local-compute AI inference workloads.
Aetina’s President, Joe Lo, expresses excitement about the collaboration, stating, “This partnership with Mobilint not only introduces innovative AI semiconductor technology to Aetina’s edge computing platforms but also delivers a unique value proposition that balances performance and cost-effectiveness. Moving forward, both companies are committed to expanding cross-industry projects, enhancing global market reach, and collectively driving the widespread adoption of edge AI.”
The joint efforts of Aetina and Mobilint aim to foster additional cross-industry alliances and accelerate the global implementation of edge AI technologies.
Mobilint specializes in high-performance, low-power AI semiconductors, including AI SoCs and AI ASIC accelerator cards, tailored for real-time AI applications. Meanwhile, Aetina offers scalable edge AI computing platforms, utilizing NVIDIA GPU-accelerated systems and modular AI hardware.
By integrating their respective technologies and resources, Aetina and Mobilint are poised to deliver optimized solutions that drive the advancement of edge AI innovation.
Aetina recently unveiled small volume “Preview Kits” for NVIDIA Jetson Thor, targeting AI applications in advanced robotics and physical AI scenarios.
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Aetina | edge AI | edge computing | Mobilint | semiconductor | Smart Manufacturing
