Summary:
- Vertiv is expanding its CoolChip CDU family with new models in EMEA, enhancing its position in AI and HPC infrastructure.
- The new models offer flexible and scalable liquid cooling solutions for retrofit or greenfield data center environments.
- The CoolChip CDU family is part of Vertiv’s comprehensive liquid cooling offering, supported by Vertiv Liquid Cooling Services.
Rewritten Article:
Vertiv Introduces New CoolChip CDU Models for Liquid Cooling Solutions
Vertiv, a leading innovator in AI and HPC infrastructure, is proud to announce the expansion of its CoolChip CDU family in Europe, the Middle East, and Africa (EMEA). The new additions – Vertiv CoolChip CDU 70, Vertiv CoolChip CDU 100, and Vertiv CoolChip CDU 600 models – are set to revolutionize the liquid cooling landscape in the region.
Sam Bainborough, Vice President of EMEA thermal business at Vertiv, emphasizes the importance of providing customers with adaptable liquid cooling solutions to meet their evolving needs. The new CoolChip CDU models are designed to cater to both retrofit and greenfield data center environments, offering in-rack and row-based configurations, as well as liquid-to-air and liquid-to-liquid technologies.
The CoolChip CDU family is part of Vertiv’s comprehensive liquid cooling portfolio, which includes the Vertiv 360AI range of power, cooling, and services tailored to address the complex challenges of AI deployment. Backed by Vertiv Liquid Cooling Services, these innovative solutions support a wide range of scenarios, from retrofitting existing facilities to scaling high-density AI and HPC clusters in new builds.
The Vertiv CoolChip CDU 70 is an in-row, liquid-to-air coolant distribution unit designed for data centers looking to integrate liquid cooling without major infrastructure changes. With a cooling capacity of up to 70 kW, this CDU offers agility, scalability, and real-time monitoring capabilities for efficient thermal performance across multiple racks.
For operators seeking high-density liquid cooling solutions, the Vertiv CoolChip CDU 100 delivers powerful liquid-to-liquid in-rack cooling performance. With 100 kW of cooling capacity in a space-efficient 4U form factor, this model is ideal for incremental growth or AI pilot programs without the need for large-scale infrastructure changes.
Lastly, the Vertiv CoolChip CDU 600 is a robust, scalable liquid-to-liquid model designed for high-density AI and HPC deployments in hyperscale and colocation environments. With redundant pumps, advanced monitoring capabilities, and a flexible approach to deployment, this 600 kW system offers reliability, visibility, and performance for customers scaling liquid cooling across broader IT environments.
In conclusion, Vertiv’s new CoolChip CDU models are set to redefine liquid cooling solutions in EMEA, providing customers with flexible, scalable, and innovative options to meet the growing demands of AI and HPC infrastructure.
