Summary:
- Wiwynn presented its double-wide rack architecture at the OCP Global Summit 2025 to address the industry’s trend towards larger, higher-power AI chips.
- The innovative architecture combines HVDC power delivery, liquid cooling, and signal-integrity-optimized layout to tackle challenges in high-density computing.
- Key innovations include a double-wide rack design, HVDC power delivery, and advanced liquid cooling solutions for next-generation AI infrastructure.
Article:
Revolutionizing AI Infrastructure: Wiwynn Unveils Double-Wide Rack Architecture at OCP Global Summit 2025
At the recent OCP Global Summit 2025, Wiwynn, a leading cloud IT infrastructure provider, showcased its groundbreaking double-wide rack architecture designed to meet the growing demand for larger and more powerful AI chips in data centers. This cutting-edge solution aims to drive the future of artificial intelligence by transforming concepts into reality.
Innovative Design for High-Density Computing Challenges
Wiwynn’s double-wide rack architecture addresses various challenges in high-density computing, including data transmission, power delivery, thermal management, and mechanical issues. By incorporating an HVDC power rack and busbar, sophisticated liquid cooling system, and signal-integrity-optimized compute/switch layout, Wiwynn has created a solution that is at the forefront of AI infrastructure innovation.
Key Innovations Driving AI Transformation
One of the key innovations of Wiwynn’s architecture is the double-wide rack design, which can accommodate expanding chip and module footprints as computing demands increase. The rack supports substrates up to 120 × 150 mm and chips scaling to 9.5 reticle with 12x HBM, minimizing cable routing and signal loss while maintaining high-speed interconnects and signal integrity.
Additionally, the architecture utilizes HVDC power delivery to match the soaring power density at the rack level. By converting AC to ±400/800 VDC and distributing it through vertical and horizontal busbars, Wiwynn’s HVDC power rack improves energy efficiency and scalability while reducing distribution losses significantly.
Furthermore, Wiwynn’s advanced liquid cooling solutions are integrated into the architecture to regulate temperature and enhance stability and safety. This includes high-efficiency cold plates, in-row CDUs, liquid-cooling management, and other components designed to support 4 kW class chip thermal capacity effectively.
Looking Towards the Future of AI Infrastructure
President and CEO of Wiwynn, William Lin, emphasized the importance of adapting to the evolving landscape of AI computing. He stated, "An era of more power and bigger packaging footprints is quickly approaching in AI. Out-of-the-box thinking is necessary to meet rapidly changing compute-density demands." Wiwynn’s double-wide rack architecture aims to provide effective, scalable, and sustainable infrastructure for next-generation AI, overcoming conventional boundaries and optimizing rack-level performance across compute and signal integrity.
In conclusion, Wiwynn’s innovative double-wide rack architecture represents a significant step forward in the evolution of AI infrastructure, offering a comprehensive solution to the challenges of high-density computing and paving the way for the future of artificial intelligence.
